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Vision & Mission
vedprakash@nitsri.net
7292003792
Dal Block, NIT Srinagar, Hazratbal
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Dr.VED PRAKASH SHARMA

Assistant Professor

Microelectronics Package Reliability, De-lamination and Fracture Among Multi-layer Structures, Fracture Mechanics, Failure Analysis, FE Analysis, Cohesive Zone Modelling

Education

Degree Institute CGPA Year Subject Description
Ph. D. 0 IIT Delhi, Reliability of microelectronic packages, Fracture Mechanics
B.TECH 0 BIET Jhansi Mechanical Engineering

Publications Journal

Month-Year Authors Paper Title Volume PageNo DOI Impact Factor Type Journal Name
JAN 2022 Effect of bond-line thickness and mode-mixity on the fracture behavior and traction separation law of Sn-0.7Cu solder joints, Engineering Failure Analysis, Elsevier, https://doi.org/10.1016/j.engfailanal.2021.105855
MAR 2022 Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints, Journal of Electronic Packaging, ASME, https://doi.org/10.1115/1.4054096
SEP 2021 Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints, Microelectronics Reliability, Elsevier, https://doi.org/10.1016/j.microrel.2021.114381

Book Published